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Bending Machine for Pipes & Tubes

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Application Equipments
Electronic Machinery & Equipment

Equipment for Semiconductor
Automated Glue Dispenser - SDS-6001

Suitable Industries

Semiconductor seal and envelopment.

Features and Benefits

Specification of Machine

Item Specification
Working route
X-axis: 350mm (as request)
Y-axis: 60mm (as request)
Z-axis: 10mm (as request)
PTP(X,Y): 0~500mm/sec
PTP(Z): 0~500mm/sec
CP(Y,Z): 0~500mm/sec
Accuracy Repeating ±0.02mm
Load of Z-axis 10kg
Cycle time 0.3sec/point
Air pressure 1~7kg/cm2
Material Supply ON-LINE
Height of workingtable 1110±20mm
Weight 160kg
Size (LxWxH) 870x600x1710 (mm)