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Electronic Machinery & Equipment


Equipment for Semiconductor

Wafer Cleaning M/C - SWW-6008

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Suitable Industries

Use for semiconductor wafer dicing.

Features and Benefits

Specification of Machine

Item Specification
Size ofwafer 4"~6"
Programme Importing by keyborad
Air pressure 0~6KG/CM2
Loading Manual
Control Plc control with touch screen
RPM 0~2500 RPM
Height of table 980mm
Diemension 600(L)x785(W)x1500(H) MM
Wieght 150KGS