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Home>Products>Electronic Equipment>Equipment for Semiconductor>Wafer Cleaning M/C

Wafer Cleaning M/C

SWW-6008

Suitable industries:

Use for semiconductor wafer dicing

Features and Benefits:

• Able to adsorb wafer
• Adjustable rpm of rotation table
• Adjustable angle of air blow
• Adjustable angle of water irrigation
• Able to use different speed of rotation table for air blowing & water irrigating

Specification of machine

Item	Specification
Size ofwafer	4"~6"
Programme	Importing by keyborad
Air pressure	0~6KG/CM2
Loading	Manual
Control	Plc control with touch screen
RPM	0~2500 RPM
Height of table	980mm
Diemension	600(L)x785(W)x1500(H)MM
Wieght	150KGS