Products
Pipe Bender | Tube Bender | Tube Bending Machine | Pipe Bending Machine
Home>Products>Electronic Equipment>Equipment for Semiconductor>HB-LED Ultrasonic Filp Chip Bonding M/C
HB-LED Ultrasonic Filp Chip Bonding M/C
HBLED-FC-9201
Suitable industries:
Used for HB-LED, Ⅲ-Ⅴsemiconductor, optical communication and other flip-chips
Features and Benefits:
- Adopt with servo motor and vision system for high speed feeding and positioning
- Adjustable bond force by servo control
- Use uph3000 ultrasound for bonding
- Able to work with ggi process
- Temperature contorl within 150~200°C to keep the quality of bonding
- Use chip to wafer producton mold for mass production
- Easy operation & maintainance
Specification of machine
| Item | Specification |
| Accuracy |
±10μm(XY placement), ±0.1°(θ rotation) |
| Submount size |
Max. 6"(150mm); 8" Option |
| Chip size | 0.3×0.3mm~2.4×2.4mm/0.10.7mm(Thickness) |
| Translation range | Wafers: 150mm×150mm |
| Rotation range | Wafers: ±15° Pick-up heads: ±180° |
| UPH | Above3000 |
| Bond force | 20-2000g |
| System requirement | Power: 220V AC, 50/60Hz, 3O, 40A Pneumatic source: 5kg/cm2; Vacuum: 450mm-Hg |
Relative Product:
- Home>Products>Electronic Equipment>Equipment for Semiconductor>HB-LED Ultrasonic Filp Chip Bonding M/C
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Test Handler
- Home>Products>Electronic Equipment>Equipment for Semiconductor>CO2 Antistatic Pure Water Changing M/C
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Wafer Cleaning M/C
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Automated Glue Dispenser
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Lead Frame Loader
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Wafer Mounter
- Home>Products>Electronic Equipment>Equipment for Semiconductor>IC Packaging Machine
