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HB-LED Ultrasonic Filp Chip Bonding M/C
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Application Equipments
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Electronic Machinery & Equipment

Equipment for Semiconductor

HB-LED Ultrasonic Filp Chip Bonding M/C - HBLED-FC-9201

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Suitable Industries

Used for HB-LED, Ⅲ-Ⅴsemiconductor, optical communication and other flip-chips.

Features and Benefits

Specification of Machine

Item Specification
±10μm (XY placement), ±0.1° (θ rotation)
Submount size
Max. 6"(150mm); 8" Option
Chip size 0.3x0.3mm~2.4x2.4mm/0.10.7mm(Thickness)
Translation range Wafers: 150mmx150mm
Rotation range Wafers: ±15° Pick-up heads: ±180°
UPH Above3000
Bond force 20-2000g
System requirement
Power: 220V AC, 50/60Hz, 3O, 40A
Pneumatic source: 5kg/cm2; Vacuum: 450mm-Hg