Home>Products>Electronic Equipment>Equipment for Semiconductor>HB-LED Ultrasonic Filp Chip Bonding M/C

Pipe & Tube Bender

Auto Pipe Bender Semi Auto Pipe Bender Special Customer Pipe Bender

Bike Production Machine

For Pre-Preparation For Fork Preparation For Front Fork Process For Frame Assembling For Wheel / Rim Making For Bike Assembling For EN Tester For Handlebar Process For Fixture

End Forming Machinery

Pipe Shape Forming Machine Pipe End Forming Machine Pipe End Processing Machine

Electronic Equipment

Automated Dispenser Series Laser Marker Series Equipment for Semiconductor
HB-LED Ultrasonic Filp Chip Bonding M/C
Test Handler
CO2 Antistatic Pure Water Changing M/C
Wafer Cleaning M/C
Automated Glue Dispenser
Lead Frame Loader
Wafer Mounter
IC Packaging Machine
Equipment for Optical Communication Single Mechanism of Automated Equipment

Auto Cell Welding Robot

Hydroforming OEM

Application Equipments
Image of Tube Bending Machine

Electronic Machinery & Equipment


Equipment for Semiconductor

HB-LED Ultrasonic Filp Chip Bonding M/C - HBLED-FC-9201

Image of HB-LED Ultrasonic Filp Chip Bonding M/C

Suitable Industries

Used for HB-LED, Ⅲ-Ⅴsemiconductor, optical communication and other flip-chips.

Features and Benefits

Specification of Machine

Item Specification
Accuracy
±10μm (XY placement), ±0.1° (θ rotation)
Submount size
Max. 6"(150mm); 8" Option
Chip size 0.3x0.3mm~2.4x2.4mm/0.10.7mm(Thickness)
Translation range Wafers: 150mmx150mm
Rotation range Wafers: ±15° Pick-up heads: ±180°
UPH Above3000
Bond force 20-2000g
System requirement
Power: 220V AC, 50/60Hz, 3O, 40A
Pneumatic source: 5kg/cm2; Vacuum: 450mm-Hg