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Home>Products>Electronic Equipment>Equipment for Semiconductor>HB-LED Ultrasonic Filp Chip Bonding M/C

HB-LED Ultrasonic Filp Chip Bonding M/C

HBLED-FC-9201

Suitable industries:

Used for HB-LED, Ⅲ-Ⅴsemiconductor, optical communication and other flip-chips

Features and Benefits:

• Adopt with servo motor and vision system for high speed feeding and positioning
• Adjustable bond force by servo control
• Use uph3000 ultrasound for bonding
• Able to work with ggi process
• Temperature contorl within 150~200°C to keep the quality of bonding
• Use chip to wafer producton mold for mass production
• Easy operation & maintainance

Specification of machine

Item	Specification
Accuracy	±10μm(XY placement), ±0.1°(θ rotation)
Submount size	Max. 6"(150mm); 8" Option
Chip size	0.3×0.3mm～2.4×2.4mm/0.10.7mm(Thickness)
Translation range	Wafers: 150mm×150mm
Rotation range	Wafers: ±15° Pick-up heads: ±180°
UPH	Above3000
Bond force	20-2000g
System requirement	Power: 220V AC, 50/60Hz, 3O, 40A Pneumatic source: 5kg/cm2; Vacuum: 450mm-Hg