HB-LED Ultrasonic Filp Chip Bonding Machine - Shuz Tung Machinery - Taiwan HB-LED Ultrasonic Filp Chip Bonding M/C Manufacturer

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HB-LED Ultrasonic Filp Chip Bonding M/C
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Equipment for Semiconductor

HB-LED Ultrasonic Filp Chip Bonding M/C - HBLED-FC-9201

Image of HB-LED Ultrasonic Filp Chip Bonding M/C

Suitable Industries

Used for HB-LED, Ⅲ-Ⅴsemiconductor, optical communication and other flip-chips.

Features and Benefits

Adopt with servo motor and vision system for high speed feeding and positioning.
Adjustable bond force by servo control.
Use uph3000 ultrasound for bonding.
Able to work with ggi process.
Temperature contorl within 150~200°C to keep the quality of bonding.
Use chip to wafer producton mold for mass production.
Easy operation & maintainance.

Specification of Machine

Item	Specification
Accuracy	±10μm (XY placement), ±0.1° (θ rotation)
Submount size	Max. 6"(150mm); 8" Option
Chip size	0.3x0.3mm～2.4x2.4mm/0.10.7mm(Thickness)
Translation range	Wafers: 150mmx150mm
Rotation range	Wafers: ±15° Pick-up heads: ±180°
UPH	Above3000
Bond force	20-2000g
System requirement
	Power: 220V AC, 50/60Hz, 3O, 40A
	Pneumatic source: 5kg/cm²; Vacuum: 450mm-Hg