Products
Pipe Bender | Tube Bender | Tube Bending Machine | Pipe Bending Machine
Home>Products>Electronic Equipment>Equipment for Semiconductor>Automated Glue Dispenser
Automated Glue Dispenser
SDS-6001
Suitable industries:
Semiconductor seal and envelopment
Features and Benefits:
- The working route of X-axis is 350mm, Y-axis is 60mm, Z-axis is 10mm.
- The highest speed is 500mm/s.
- The accuracy in repeating and position is ±0.02mm.
- The machine provides loader and un-loader systems to join production line of other machines.
- Equipped with special designed fixture is anti-shock and anti-scratch.
Specification of machine
| Item | Specification | ||||||
| Working route |
|
||||||
| Speed |
|
||||||
| Accuracy Repeating | ±0.02mm | ||||||
| Load of Z-axis | 10kg | ||||||
| Cycle time | 0.3sec/point | ||||||
| Air pressure | 1~7kg/cm2 | ||||||
| Material Supply | ON-LINE | ||||||
| Height of workingtable | 1110±20mm | ||||||
| Weight | 160kg | ||||||
| Size | (L×W×H)870×600×1710(mm) |
Specification of controller
| Item | Specification |
| Power Supply |
110V/220V Fully-voltage 50/60HZ 3-phrase |
| Mode of Drive | X、Y、Z AC servo motor |
| Program System | CNC controller |
| Transmission of file | RS232-C2ch(1ch option) |
| I/O | IN: 20; OUT: 8(24 I/O option) |
| Harddiscs Capacity | 1.44MB |
| Control | In-line(3-axis), In-curve(2-axis) |
| Controlled axis | 3-axis(2-axis simultaneously) |
Relative Product:
- Home>Products>Electronic Equipment>Equipment for Semiconductor>HB-LED Ultrasonic Filp Chip Bonding M/C
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Test Handler
- Home>Products>Electronic Equipment>Equipment for Semiconductor>CO2 Antistatic Pure Water Changing M/C
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Wafer Cleaning M/C
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Automated Glue Dispenser
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Lead Frame Loader
- Home>Products>Electronic Equipment>Equipment for Semiconductor>Wafer Mounter
- Home>Products>Electronic Equipment>Equipment for Semiconductor>IC Packaging Machine
